1. 2. 3. material content data sheet sales product name skp15n60 issued 29. august 2013 ma# MA000695012 package pg-to220-3-1 weight* 2037.86 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.572 0.22 0.22 2243 2243 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.01 40.06 400093 400615 wire non noble metal aluminium 7429-90-5 53.594 2.63 2.63 26299 26299 encapsulation organic material carbon black 1333-86-4 5.481 0.27 2690 plastics epoxy resin - 104.141 5.11 51103 inorganic material silicondioxide 60676-86-0 438.486 21.52 26.90 215171 268964 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10532 10532 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder non noble metal antimony 7440-36-0 0.325 0.02 159 noble metal silver 7440-22-4 0.812 0.04 398 non noble metal tin 7440-31-5 2.110 0.10 0.16 1035 1592 heatspreader non noble metal iron 7439-89-6 0.590 0.03 290 inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal copper 7440-50-8 589.466 28.93 28.97 289258 289635 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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